1. Background

As AI computing chips evolve towards larger sizes and higher integration, traditional packaging substrates are gradually approaching their physical limits. Glass substrates have become the preferred carrier for giants such as TSMC and Intel to deploy advanced packaging technologies such as CoWoS and HBM, thanks to their advantages such as lower signal loss and higher dimensional stability.

On March 19-20, Aibang Semiconductor held the 2025 Glass Substrate TGV Industry Chain Summit Forum in Suzhou. More than 600 experts, scholars and relevant personnel from well-known companies, research institutes, associations and other institutions in the industry participated in the discussion, and 20 industry leaders gave wonderful speeches. The two-day forum speeches were packed, the exchanges at the on-site booths were as heated as boiling water, and the sparks of thought continued to burst out in the warm atmosphere.

When the forum was about to end, nearly 2/3 of the participants were still there, and everyone was still eager to learn more. From this forum, it was enough to feel that everyone had a strong interest in the glass substrate TGV industry and was looking forward to the development prospects of the industry.

In order to continuously promote the development of the industry, promote upstream and downstream exchanges, and jointly explore market opportunities, Abang Semiconductor will hold the 2nd Glass Substrate TGV Industry Chain Summit Forum at the Shenzhen Bao'an International Convention and Exhibition Center from August 26 to 27, 2025, and will also hold the 2025 Glass Substrate and Packaging Industry Chain Exhibition at the same time.

Organizers:

Shenzhen Aibang Intelligent Manufacturing Information Co., Ltd.

Website: www.ab-sm.com

Time:August 26-27, 2025

Location: Hall 7, Shenzhen Baoan International Convention and Exhibition Center

2. Agenda (TBD)

3.Feedback Channel:

The final agenda and list of speakers will be updated in the near future and on the day of the conference. If you are interested in participating as a speaker or exhibitor at the 2nd TGV Forum, or if you are interested in opportunities for sponsorship, advertising, article submissions, conducting interviews, or if you have leading technology or product solutions, please contact Rongrong via email at lirongrong@aibang.com, Additional contact number: +8618823755657, or add Rongrong on WeChat: aibang360040.

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