玻璃基板可以比晶圆更大，尺寸为 600 x 600 毫米。由于其方形形状，甚至可以有效地利用板的角落。挑战在于控制玻璃基板的翘曲，保持布线材料和光刻胶材料的厚度均匀，并形成高密度的电路。为了解决这些问题，该公司开发了可高精度控制液晶面板厚度的涂层技术，以及为液晶面板开发的处理大型玻璃基板的技术，实现了在顶部形成高密度再分布层。
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活动推荐：
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Topic |
Companies to be invited |
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Challenges and solutions of TGV glass core technology |
Guangdong Fozhixin Microelectronics Technology Research Co., LTD |
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Difficulties in the production of TGV metal lines and their technical solutions |
Hubei TGVTECH Co., Ltd. |
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Glass core substrate: a new generation of advanced packaging technology |
AKM Meadville Electronics (Xiamen) Co. Ltd. |
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The latest generation of TGV technology and applications |
3D CHIPS (GUANGDONG) TECHNOLOGYCO.,LTD |
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SCHOTT glass enables advanced packaging |
SCHOTT Group |
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Application of microscope in semiconductor advanced packaging defect detection |
Guangdong Huipuguangxue Technology Co., Ltd. |
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Prospects for the application of through-glass technology in advanced packaging |
Xiamen Sky Semiconductor Technology Co.Ltd. |
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Discussion on the filling technology of through-hole in glass substrate |
Guangdong Tiancheng Technology Co., Ltd. |
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Laser-induced deep etching technology is used to realize the processing of glass substrates with integrated multi-functional structures |
乐普科 中国区 |
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Design, development and application of high-performance IPD based on TGV |
ShangHai Xpeedic Co., Ltd. |
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Application of Multi-physics Simulation Technology in Glass-based Advanced Packaging |
Hunan More Than Moore Advanced Semiconductor Co.,Ltd. |
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High-density glass-level packaging and heterogeneous integration process development challenges and solutions |
Chengdu ECHINT Technology Co., Ltd. |
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Application of PVD equipment in deep hole coating in TGV technology |
Guangdong Huicheng Vacuum Technology Co., Ltd. |
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From round to square: Evatec's advanced packaging substrate FOPLP etching and sputtering solutions |
Evatec China |
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The latest progress and future prospects of glass substrate packaging technology |
Shenzhen Fanxin Integrated Semiconductor Co., Ltd. |
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Innovative technologies and applications of glass substrates: from plasma vias to surface modification and metal seed layer technology |
UVAT Technology co.,Ltd. |
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Panel level laser induced etching & AOI |
Shenzhen GH LASER Co., Ltd. |
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Integrated passive on glass substrate |
SUzhou senwan Electronic Technology Co., Ltd. |
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玻璃基板量产线 铜线路蚀刻工艺 |
广州市巨龙印制板设备有限公司 |
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用于TGV封装领域的光学量检测技术 |
北京电子量检测股份有限公司 |
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原文始发于微信公众号（艾邦半导体网）：东丽工程开发玻璃基板设备，实现 2.5/3D 封装
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