1. Background

Glass substrate is the next generation chip substrate, and the core material is made of glass. The glass substrate industry chain includes production, raw materials, equipment, technology, packaging, testing, application and other links, with the upstream being production, raw materials, and equipment links. Due to its unique physical and chemical properties, glass substrates have shown great potential in the field of electronic component material applications.

In pursuit of pushing the limits of Moore's Law, major manufacturers such as Intel, Samsung, NVIDIA, and TSMC have entered the glass substrate industry. Intel was the first to launch glass substrates for advanced packaging, promoting the advancement of Moore's Law;

Samsung regards glass substrates as the future of chip packaging and has formed an "army" to increase research and development of glass substrates. NVIDIA's GB200 may use glass substrates and plans to go into production. TSMC has formed a dedicated team to explore FOPLP technology and invested heavily in glass substrate research and development.

The key technology of glass substrate packaging is through-glass via. TGV interconnection technology can be traced back to 2008. It is derived from 2.5D/3D integrated TSV adapter board technology. It is mainly used to solve the problems of TSV adapter board due to silicon substrate loss, high material cost and complex process. In recent years, the technology has been increasingly improved. Various leading companies have begun to lay out and produce some samples for different fields including: sensors, CPU, GPU, A1, display panels, medical devices, semiconductor advanced packaging, etc.

The global IC packaging substrate market is developing rapidly, and is expected to reach US$31.54 billion in 2029. Glass substrates are the latest trend, and the penetration rate is expected to reach more than 50% within 5 years. The global glass substrate market has broad space, and is expected to grow to US$11.3 billion in 2031. The scale of China's glass substrate market continues to expand, reaching 33.3 billion yuan in 2023. Corning dominates the global market, accounting for 48%. Domestic manufacturers have significant cost advantages, and the localization of glass substrates has accelerated, with huge market space. In the second half of 2024, TGV's corporate layout will accelerate!

In order to promote the development of the industry, Aibang will hold the Glass Substrate TGV Industry Chain Summit Forum in Suzhou from March 19 to 20, 2025. The conference will bring together leading experts, scholars and corporate representatives in the industry to discuss the future trends, technological innovations and market opportunities of glass substrates.

Organizers:Shenzhen Aibang Intelligent Manufacturing Information Co., Ltd., www.ab-sm.com

1. Agenda (TBD)

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3.Feedback Channel:

The final agenda and speaker list will be adjusted in the near future and on the day of the conference. If you are interested in participating in 2025 TGV Forum as a speaker or exhibitor, or in sponsoring, advertising, submitting articles, or conducting interviews, or if you have leading technology or product solutions, please send them to lirongrong@aibang.com

, or add Rongrong on WeChat: aibang360040.

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