来源：今日崇州、成都发布、液晶网
1.http://www.viatrontech.com/kr/ir/disclosure.php
2.https://markets.hankyung.com/stock/068790/public-announcement
艾邦建有玻璃基板与TGV技术交流群，可以加强产业链的合作，促成各企业的需求对接，同时您也可以与行业精英共同探讨玻璃基板及TGV技术的前沿动态，共享资源，交流经验，欢迎您的加入。
活动推荐：
|
Topic |
Companies to be invited |
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Challenges and solutions of TGV glass core technology |
Guangdong Fozhixin Microelectronics Technology Research Co., LTD |
|
Difficulties in the production of TGV metal lines and their technical solutions |
Hubei TGVTECH Co., Ltd. |
|
Glass core substrate: a new generation of advanced packaging technology |
AKM Meadville Electronics (Xiamen) Co. Ltd. |
|
The latest generation of TGV technology and applications |
3D CHIPS (GUANGDONG) TECHNOLOGYCO.,LTD |
|
SCHOTT glass enables advanced packaging |
SCHOTT Group |
|
Application of microscope in semiconductor advanced packaging defect detection |
Guangdong Huipuguangxue Technology Co., Ltd. |
|
Prospects for the application of through-glass technology in advanced packaging |
Xiamen Sky Semiconductor Technology Co.Ltd. |
|
Discussion on the filling technology of through-hole in glass substrate |
Guangdong Tiancheng Technology Co., Ltd. |
|
Laser-induced deep etching technology is used to realize the processing of glass substrates with integrated multi-functional structures |
乐普科 中国区 |
|
Design, development and application of high-performance IPD based on TGV |
ShangHai Xpeedic Co., Ltd. |
|
Application of Multi-physics Simulation Technology in Glass-based Advanced Packaging |
Hunan More Than Moore Advanced Semiconductor Co.,Ltd. |
|
High-density glass-level packaging and heterogeneous integration process development challenges and solutions |
Chengdu ECHINT Technology Co., Ltd. |
|
Application of PVD equipment in deep hole coating in TGV technology |
Guangdong Huicheng Vacuum Technology Co., Ltd. |
|
From round to square: Evatec's advanced packaging substrate FOPLP etching and sputtering solutions |
Evatec China |
|
The latest progress and future prospects of glass substrate packaging technology |
Shenzhen Fanxin Integrated Semiconductor Co., Ltd. |
|
Innovative technologies and applications of glass substrates: from plasma vias to surface modification and metal seed layer technology |
UVAT Technology co.,Ltd. |
|
Panel level laser induced etching & AOI |
Shenzhen GH LASER Co., Ltd. |
|
Integrated passive on glass substrate |
SUzhou senwan Electronic Technology Co., Ltd. |
|
玻璃基板量产线 铜线路蚀刻工艺 |
广州市巨龙印制板设备有限公司 |
李小姐：18823755657（同微信）
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原文始发于微信公众号（艾邦半导体网）：近10亿！达成4项玻璃基板“合作+订单”
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