12月29日，肖特集团宣布，为强化其在半导体制造领域的布局，已签署最终协议，收购德国尖端科技企业QSIL GmbH Quarzschmelze Ilmenau。这将使肖特扩展在高性能石英玻璃领域的产品组合，而石英玻璃是微芯片制造的重要材料。
QSIL GmbH在德国伊尔梅瑙拥有一流的生产设施、独特技术，以及约275名技术娴熟的员工，推动了其市场地位。加入SCHOTT全球网络后，双方在半导体制造领域的增长潜力将进一步释放。
生产透明石英玻璃中空圆柱（坯料）。照片来源：QSIL
十多年来，肖特一直为半导体行业提供包括高精度光刻设备和测量仪器的特种材料与组件、用于新一代封装的玻璃面板等高端解决方案。
来源：肖特集团官网，文章仅供参考，如涉及到侵权等问题，请联系小编删除
艾邦建有玻璃基板与TGV技术交流群，可以加强产业链的合作，促成各企业的需求对接，同时您也可以与行业精英共同探讨玻璃基板及TGV技术的前沿动态，共享资源，交流经验，欢迎您的加入。
活动推荐：
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Topic |
Companies to be invited |
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Challenges and solutions of TGV glass core technology |
Guangdong Fozhixin Microelectronics Technology Research Co., LTD |
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Difficulties in the production of TGV metal lines and their technical solutions |
Hubei TGVTECH Co., Ltd. |
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Glass core substrate: a new generation of advanced packaging technology |
AKM Meadville Electronics (Xiamen) Co. Ltd. |
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The latest generation of TGV technology and applications |
3D CHIPS (GUANGDONG) TECHNOLOGYCO.,LTD |
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SCHOTT glass enables advanced packaging |
SCHOTT Group |
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Application of microscope in semiconductor advanced packaging defect detection |
Guangdong Huipuguangxue Technology Co., Ltd. |
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Prospects for the application of through-glass technology in advanced packaging |
Xiamen Sky Semiconductor Technology Co.Ltd. |
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Discussion on the filling technology of through-hole in glass substrate |
Guangdong Tiancheng Technology Co., Ltd. |
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Laser-induced deep etching technology is used to realize the processing of glass substrates with integrated multi-functional structures |
乐普科 中国区 |
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Design, development and application of high-performance IPD based on TGV |
ShangHai Xpeedic Co., Ltd. |
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Application of Multi-physics Simulation Technology in Glass-based Advanced Packaging |
Hunan More Than Moore Advanced Semiconductor Co.,Ltd. |
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High-density glass-level packaging and heterogeneous integration process development challenges and solutions |
Chengdu ECHINT Technology Co., Ltd. |
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Application of PVD equipment in deep hole coating in TGV technology |
Guangdong Huicheng Vacuum Technology Co., Ltd. |
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From round to square: Evatec's advanced packaging substrate FOPLP etching and sputtering solutions |
Evatec China |
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The latest progress and future prospects of glass substrate packaging technology |
Shenzhen Fanxin Integrated Semiconductor Co., Ltd. |
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Innovative technologies and applications of glass substrates: from plasma vias to surface modification and metal seed layer technology |
UVAT Technology co.,Ltd. |
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Panel level laser induced etching & AOI |
Shenzhen GH LASER Co., Ltd. |
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Integrated passive on glass substrate |
SUzhou senwan Electronic Technology Co., Ltd. |
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玻璃基板量产线 铜线路蚀刻工艺 |
广州市巨龙印制板设备有限公司 |
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用于TGV封装领域的光学量检测技术 |
北京电子量检测股份有限公司 |
李小姐：18823755657（同微信）
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原文始发于微信公众号（艾邦半导体网）：肖特收购尖端石英玻璃企业QSIL GmbH，扩大玻璃基板布局
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