1月15日,三星电机宣布与当地材料公司 Soulbrain 建立战略合作伙伴关系,共同开发玻璃基板材料,该材料是下一代人工智能 (AI) 半导体的关键组件。此次合作旨在到 2027 年大规模生产这些基板,从而扩大三星电机的供应链生态系统。
据业内人士1月14日透露,两家公司已开始研究用于玻璃基板制造的蚀刻液。这些溶液对于在玻璃上钻出细孔和去除工艺过程中产生的杂质至关重要。Soulbrain是韩国最大的IT设备化学材料公司,曾为三星显示器供应OLED工艺蚀刻液。鉴于OLED面板中玻璃的大量使用,人们对Soulbrain的蚀刻液技术能否有效应用于玻璃基板颇感兴趣。
业内人士表示,“Soulbrain不仅拥有蚀刻液的量产经验,还拥有半导体和显示面板工序所需的沉积材料和抛光液的量产经验,与竞争对手相比拥有更出色的材料竞争力”。
三星电机正加速玻璃基板的商业化,认为玻璃基板时代将在几年内开始。为了实现这一计划,该公司正与国内外多家材料、零部件和设备公司合作,包括 Soulbrain,建立供应链。
另外在1月14日,据“韩国邮政局”报道,美国半导体、显示器设备制造商 Applied Materials 将向三星电机供应玻璃芯基板的溅射设备。据了解,三星电机决定将TGV(玻璃穿通电极)工艺的金属化(以下简称金属)部分内部化,正在安装相关试点设施。
注:图片和内容来源于KIPOST、Businesskorea,文章仅供参考,如涉及到侵权等问题,请联系小编删除
艾邦建有玻璃基板与TGV技术交流群,可以加强产业链的合作,促成各企业的需求对接,同时您也可以与行业精英共同探讨玻璃基板及TGV技术的前沿动态,共享资源,交流经验,欢迎您的加入。
活动推荐:
Topic |
Companies to be invited |
Challenges and solutions of TGV glass core technology |
Guangdong Fozhixin Microelectronics Technology Research Co., LTD |
Difficulties in the production of TGV metal lines and their technical solutions |
Hubei TGVTECH Co., Ltd. |
Glass core substrate: a new generation of advanced packaging technology |
AKM Meadville Electronics (Xiamen) Co. Ltd. |
The latest generation of TGV technology and applications |
3D CHIPS (GUANGDONG) TECHNOLOGYCO.,LTD |
SCHOTT glass enables advanced packaging |
SCHOTT Group |
Application of microscope in semiconductor advanced packaging defect detection |
Guangdong Huipuguangxue Technology Co., Ltd. |
Prospects for the application of through-glass technology in advanced packaging |
Xiamen Sky Semiconductor Technology Co.Ltd. |
Discussion on the filling technology of through-hole in glass substrate |
Guangdong Tiancheng Technology Co., Ltd. |
超越TGV 的LPKF 激光诱导深度蚀刻技术 |
乐普科 中国区 |
Design, development and application of high-performance IPD based on TGV |
ShangHai Xpeedic Co., Ltd. |
Application of Multi-physics Simulation Technology in Glass-based Advanced Packaging |
Hunan More Than Moore Advanced Semiconductor Co.,Ltd. |
High-density glass-level packaging and heterogeneous integration process development challenges and solutions |
Chengdu ECHINT Technology Co., Ltd. |
Application of PVD equipment in deep hole coating in TGV technology |
Guangdong Huicheng Vacuum Technology Co., Ltd. |
From round to square: Evatec's advanced packaging substrate FOPLP etching and sputtering solutions |
Evatec China |
The latest progress and future prospects of glass substrate packaging technology |
Shenzhen Fanxin Integrated Semiconductor Co., Ltd. |
Innovative technologies and applications of glass substrates: from plasma vias to surface modification and metal seed layer technology |
UVAT Technology co.,Ltd. |
Panel level laser induced etching & AOI |
Shenzhen GH LASER Co., Ltd. |
Integrated passive on glass substrate |
SUzhou senwan Electronic Technology Co., Ltd. |
玻璃基板量产线 铜线路蚀刻工艺 |
广州市巨龙印制板设备有限公司 |
用于TGV封装领域的光学量检测技术 |
北京电子量检测股份有限公司 |
李小姐:18823755657(同微信)
邮箱:lirongrong@aibang.com
https://www.aibang360.com/m/100235?ref=100042
原文始发于微信公众号(艾邦半导体网):三星与这2家企业合作,加速玻璃基板开发