1月22日，据韩媒报道，印刷电路板（PCB）自动化设备公司Taesung最早将于第一季度供应玻璃基板试产（试点）设备。我们目前正在与一位追求玻璃基板批量生产的客户讨论详细规格。
该公司表示：“我们预计最早能够在第一季度、最迟第二季度供应玻璃基板制造设备的试生产设备”，并补充道，“我们正处于与许多客户讨论具体规格的阶段。”
一般来说，中试生产设备供货完成后，设备测试大约需要3至6个月的时间。这意味着，根据客户的意愿，有可能在今年内建立大规模生产设施。
泰成开发的设备是完成玻璃电极制造（TGV）工艺的玻璃基板的前处理设备。它可用于从蚀刻到预处理的所有过程的自动化。设计覆盖大面积（510*510mm），这是行业标准。
图源：Theelec
通过在玻璃基板上钻孔来传输电信号的 TGV 工艺至关重要。它被认为是阻碍批量生产的裂纹现象的原因。Taesung 设备专注于最大限度地减少裂缝。
Taesung申请了基于PCB设备双面图案技术的双面玻璃基板图案构造的专利。
来源：https://www.etoday.co.kr/news/view/2439827
注：文章仅供参考，如涉及到侵权等问题，请联系小编删除
艾邦建有玻璃基板与TGV技术交流群，可以加强产业链的合作，促成各企业的需求对接，同时您也可以与行业精英共同探讨玻璃基板及TGV技术的前沿动态，共享资源，交流经验，欢迎您的加入。
活动推荐：
|
Topic |
Companies to be invited |
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Challenges and solutions of TGV glass core technology |
Guangdong Fozhixin Microelectronics Technology Research Co., LTD |
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Difficulties in the production of TGV metal lines and their technical solutions |
Hubei TGVTECH Co., Ltd. |
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Glass core substrate: a new generation of advanced packaging technology |
AKM Meadville Electronics (Xiamen) Co. Ltd. |
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The latest generation of TGV technology and applications |
3D CHIPS (GUANGDONG) TECHNOLOGYCO.,LTD |
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SCHOTT glass solutions enabling advanced semiconductor packaging |
SCHOTT Group |
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Application of microscope in semiconductor advanced packaging defect detection |
Guangdong Huipuguangxue Technology Co., Ltd. |
|
Prospects for the application of through-glass technology in advanced packaging |
Xiamen Sky Semiconductor Technology Co.Ltd. |
|
Discussion on the filling technology of through-hole in glass substrate |
Guangdong Tiancheng Technology Co., Ltd. |
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超越TGV 的LPKF 激光诱导深度蚀刻技术 |
乐普科 中国区 |
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Design, development and application of high-performance IPD based on TGV |
ShangHai Xpeedic Co., Ltd. |
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Application of Multi-physics Simulation Technology in Glass-based Advanced Packaging |
Hunan More Than Moore Advanced Semiconductor Co.,Ltd. |
|
High-density glass-level packaging and heterogeneous integration process development challenges and solutions |
Chengdu ECHINT Technology Co., Ltd. |
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Application of PVD equipment in deep hole coating in TGV technology |
Guangdong Huicheng Vacuum Technology Co., Ltd. |
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From round to square: Evatec's advanced packaging substrate FOPLP etching and sputtering solutions |
Evatec China |
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The latest progress and future prospects of glass substrate packaging technology |
Shenzhen Fanxin Integrated Semiconductor Co., Ltd. |
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Innovative technologies and applications of glass substrates: from plasma vias to surface modification and metal seed layer technology |
UVAT Technology co.,Ltd. |
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Panel level laser induced etching & AOI |
Shenzhen GH LASER Co., Ltd. |
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Integrated passive on glass substrate |
SUzhou senwan Electronic Technology Co., Ltd. |
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玻璃基板量产线 铜线路蚀刻工艺 |
广州市巨龙印制板设备有限公司 |
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用于TGV封装领域的光学量检测技术 |
北京电子量检测股份有限公司 |
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原文始发于微信公众号（艾邦半导体网）：Taesung：第一季度供应玻璃基板试产设备
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