Summary of Semiconductor Industry Resources
Summary of Semiconductor Industry Resources
先进封装HDAP（High Density Advanced Package)；FOWLP、2.5D/3D、小芯片以及直接和混合键合等高密度先进封装 (HDAP) 的发展正在引发传统 IC 设计和 IC 封装设计领域的融合；The growth of High Density Advanced Packages (HDAP) such as FOWLP, 2.5D/3D, chiplets and direct and hybrid bonding is triggering a convergence of the traditional IC design and IC package-design worlds.
陶瓷封装虽然在整个封装行业里占比不大，却是性能比较完善的封装…
9月20日，通富微电官微宣布，子公司通富通达先进封测基地项目…
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